Addressing Materials Constraints

_FBP5218-2The team at Burton Industries recognizes a constrained market requires that we work as closely as possible with our customers and suppliers to keep products on schedule. We are tracking distribution partner performance. Those who are living up to commitments the majority of the time and being proactive in communicating impending issues are seeing the bulk of our spend.

We have a number of supply chain partners willing to carry bonded inventory for us and live up to their commitments. Bonded inventory gives customers maximum flexibility with minimum liability, because the majority of parts are in high demand and easy to restock should a forecast change. Where possible we are moving customers to these sources of bonded inventory, setting demand based on a 12-month forecast.

We are working to get all our volume production customers to give 26+ weeks of commitments based on component lead-times. We modify that expectation for customers with legacy products that are built on an as needed or a few times a year basis.

Here are a few tips to further mitigate component availability issues:

  • Put our design team in the design cycle from a Bill of Materials (BOM) standpoint as early as possible. We offer a free BOM scrub service to existing customers to help them assess risk in critical to design components.
  • Avoid single source parts or those with limited sources.
  • If a part has been labelled not recommended for new product use, it should also be avoided as its obsolescence risk is high.

Burton Industries’ Design Engineering team can help with all your component engineering related needs. Our pool of specialists can help you manage the increasingly complex development environments and offer full life cycle management with strong focus on cost savings and defect prevention. Capabilities include:

  • Product/PCB Design
  • PWB layout
  • Design for manufacturability (DFM)
  • Component selection assistance (alternative sourcing)
  • Development of manufacturing aids (fixtures, stencils, etc.)
  • RoHS conversion assistance
  • Product Lifecycle Management (PLM) recommendations

 

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Reducing Risk of Field Failures: Benefits of Conformal Coating and Potting

By Jeff Brattrud, Burton Industries’ Engineering Manager

Anyone who has spilled a cup of coffee on a keyboard or dropped a cell phone in water understDSC05352ands the negative effects that moisture can have on the operation of electronic products. Products used in harsh environments with regular exposure to temperature extremes, water, humidity, sand or salt spray can also have performance issues. One way to mitigate that risk is to either coat or encapsulate all or part of the printed circuit board assembly (PCBA).

Conformal coating is the most widely used method and acrylics are among the most popular conformal coating material. Acrylics are easy to apply and easy to rework. Silicone is also popular. However, it is harder to remove for rework. Rework on silicone-coated PCBAs requires use of solvents unless only a small area of the product will undergo rework. The main advantage of silicone is that it is stable at higher temperatures up to 200 degrees C, which makes it appropriate for high heat applications. The team at Burton Industries uses a one-part silicone formula. Both acrylics and silicone provide good protection from moisture, fungus, dirt, dust and salt spray. Silicone provides better protection in environments that include chemicals or solvents and vibration.

Potting provides additional protection in harsh environments by encapsulating sensitive electronics. When used on a single component in a process known as “glob top,” it can protect ICs from damage or strain. Some companies use potting compounds as a means to prevent theft of proprietary data. Potting may be a better solution than conformal coating for protecting products in environments that have a lot of vibration because it provides total encapsulation. It can also help with heat dissipation, since encapsulation spreads heat more evenly. Other harsh environmental conditions it can protect against include chemical or gas exposure, shock and drops.

In selecting an appropriate potting compound, it is important to consider environmental factors and potential component stress issues. For example, a softer compound will put less stress on components, particularly when there are temperature extremes.

Both potting and conformal coating add cost to the product, although prevention of field failures can eliminate a much higher cost. Once a product is potted, it generally can’t be reworked. Products incorporating potting must either be designed with an enclosure that won’t allow seepage during cure or a mold must be made to hold the compound during cure. Curing time with potting can be longer than that of conformal coating and the curing process requires control, since heat and humidity can affect cure time.

Both coating and potting require a clean substrate for the coating or potting to adhere properly. When no clean flux is used, it must be tested to determine if an additional step is required to clean the substrate prior to coating or potting. Use of non-wettable components will add cost. At a minimum they need to be masked or protected with a fixture if dipping or spraying is used. Thickness of the coating must be controlled to stay within the design specification including the thickness tolerance.

Conformal coating and potting offer viable options for protecting products from harsh environmental conditions. The team at Burton Industries is experienced with a wide range of options and can help with both the design and selection process.

 

 

 

Conflict Minerals Identification: Burton’s Process

Legislation related to Conflict Minerals and other restricted substances continues to evolve, so Burton Industries has takes a proactive approach to help customers understand potential supply chain issues. The Company’s existing tools for online component analysis and lifecycle review database are also used to help identify status of Conflict Minerals_FBP5143.

The process starts at the RFQ stage. As part of the RFQ response, the engineering team routinely provides lifecycle analysis and identification of any component issues. This response is being enhanced to also list the Conflict Minerals classification of each component as Democratic Republic of Congo (DRC)-free, DRC undeterminable or Unknown. If the project is won, a more detailed analysis going beyond the limitations of the database tools can be performed, but this basic analysis opens the door to further discussion of Burton Industries’ engineering support capabilities.

For existing customers, a more detailed analysis can be performed as part of manufacturing or engineering services. The database tools are used initially, but Burton Industries’ team will take the additional step of determining the status of unknown components by obtaining additional information from the manufacturer and confirmation from any Burton Industries-chosen suppliers, such as PCB providers or custom device manufacturers. Recommendations for alternate sources will also be provided.

Additionally, this information will be incorporated into Design Compliance standards during the design engineering process. The process is similar to processes currently used to determine RoHS or other compliance standards.  The goal is to cost effectively assist customer’s meeting the compliance requirements that apply to their products.

 

 

A Checklist For Improving Product Design

There is a saying that what costs $10 to fix in design, costs $100 in production and $1000 out in the field. Good designs are more cost efficient to produce, have less defects in manufacturing and are generally more reliable in the _FBP5218-2field. What common design mistakes should you avoid in your next product development effort? Here are eight issues we’ve seen:

Issue 1: Lack of Proper Protection on I/O (Inputs/Outputs).  Most devices need to take input signals and output a signal to other devices out in the field.  These are generally connected via hard wiring.  This hard wiring can be susceptible to external electrical noise or power surges due to other devices or lighting strikes and electrostatic discharge (ESD).  When this happens, it is very possible for this unwanted noise to be induced onto the wiring going back into your system.  Sometimes minor, but sometimes major damage can occur making the product malfunction.  To prevent this, it is vital to design protection circuits that shunt the unwanted energy to ground.

Issue 2: Lack of Proper Power Conditioning.  For any electrical product, it is important that the incoming power is conditioned to accommodate fluctuations in power, brown out conditions, missing AC cycle and power outages.  There are a number of ways to accomplish this.  Many active ICs have some power conditioning built in and some even have the ability to monitor the power.  Otherwise, utilizing simple resistors, capacitors and inductors in various topologies accomplishes sufficient power conditioning for most designs.

Issue 3: Design for Manufacturability (DFM) Guidelines Ignored. As I always say, you only design a product once, but you build it many, many times.  Following good guidelines not only controls cost, but also ensures good quality.  Follow proper spacing when routing traces, placing vias/pads, and placing components.   Maintaining minimum distances to stay within “standard” capabilities for both fabrication and assembly results in good quality at a lower cost.

Issue 4: Design for Test (DFT) Guidelines Ignored. Process control requires a mechanism to monitor the process.  Electrical test can serve as that mechanism.  Providing at least one testable-sized via for each net on your design is good practice.  Test fixturing has become more of a commodity these days so the cost of fixtures has dropped significantly.  Keep the test pad (which can be a via) at least 35 mils diameter size and minimum 75 mils diagonal spacing to adjacent test pads.  Keep test pads minimum 75 mils from body of component and 25 mils from a component lead.  Following these two design guidelines will allow for good test coverage utilizing a lesser cost fixture.

Issue 5: Insufficient Filtering of Integrated Circuits (ICs). Placing filter capacitors (aka bypass caps) onto each IC is required to provide enough localized potential energy to allow the IC to switch properly.  The other function they serve is to filter out AC (or DC ripple) voltage as not to interfere with the function of the part.  Not having bypass caps in place may cause the IC to switch states unintentionally.

Issue 6: Insufficient Bulk Capacitance. Bulk capacitance is required to maintain proper voltage levels throughout the entire board.  Depending on board size, there may be multiple sets of bulk capacitors used.  Because the power source or power supply may not be able to provide sufficient power to all parts of the board, the bulk capacitors help provide the additional energy as needed. In other words, they help load level the supply(s).

Issue 7: Insufficient Protection for Uncontrolled Incoming Power Loss. Linear regulator protection is required to account for uncontrolled incoming power loss.  When this occurs with insufficient protection, the current will want to go through the regulator in the wrong direction, possibly damaging the component.  Ideally, a diode should be provided to shunt the current around the regulator instead of through it.

Issue 8: Failure to Utilize PCB Design Good Practices. Most products sold into market need to comply with certain agency standards, i.e. U.L., FCC, CSA, CE, etc.  In order to pass many of these standards, employing sound EMC (electromagnetic compatibility) practices is key.  The compatibility part of EMC means that a design cannot emit any electromagnetic interference nor be effected from induced electromagnetic interference.  Following the practices mentioned previously will all help with ensuring the product complies with EMC requirements.  Additionally, if you remember what was taught in basic circuits class, current (I) flowing through a wire will create an electric field.  As a result the more wires carrying current, the more fields are produced.  And a trace on a board is really nothing more than a wire.  So keeping all wires a short as possible with the least amount of resistance reduces the magnitude of the electric field(s).  These can be mitigated by providing sufficient power and ground planes which ultimately reduces ground loops.  And one more thing to remember, a loop of wire with current traveling through it is really an antenna!  This is not good for passing EMC testing.

Can Your Contractor Really Help Your Team Build Better Product?

Many companies assume that regional electronics manufacturing services (EMS) providers are more focused on building product, than helping customers build it better. That couldn’t be farther from the truth at Burton Industries. Engineering strength is one of one of our key advantages. For over 35 years, our team has been telling customers to ‘bring it on.’ Here are few examples of the problems we’ve solved:

Cost Reduction teamcrop

Many of our customers face competitive cost pressure but have limited redesign options. Our team can help. For example, in one measurement device product line we were able to apply our value engineering skills and reduce the cost of three assemblies by 12, 14 and 16 percent, respectively. The cost savings was achieved through a combination of identifying drop-in replacements for several components and eliminating some manufacturing processes.

Failure Analysis

In another case, we helped a customer address a field return issue on a system controller. Our engineering team performed failure analysis on the field returns using an outside laboratory and found no issues with the components. Further analysis showed that the problem was in the customer’s documentation. On the same assembly, a customer-initiated ECO had changed a component in error and created performance issues in the assembly. Our team worked with the customer’s team to evaluate and re-layout the board. The re-layout of the board corrected the design issues and reduced unit cost by $7.87.

Manufacturability

When a customer transferred an industrial product subassembly from another contract manufacturer, we found that design for manufacturability (DFM) analysis had never been performed. Not surprisingly, the product had a history of quality issues. Our analysis found incorrect land patterns and spacing, incorrect hole sizes, slot dimensions and locations that were missing. Components were also placed too close to the PCB edge.  We were able to re-layout the printed circuit board assemblies (PCBAs) to correct these issues.

Legacy Product

In yet another case, a medical OEM had a legacy product that needed redesign support. Our engineering team worked with customer’s engineering team to gradually convert the older PTH product to SMT, and provide DFM/DFT recommendations. The end result was more manufacturable product and improved component availability.

These are just a few of the many challenges our team solves on a day-to-day basis. We stand ready to provide a wide range of engineering support, including: design for manufacturability and test recommendations, smooth new product introductions, product lifecycle management recommendations, cost reduction suggestions and test strategy optimization.

Reducing Test Cost – Five Areas to Evaluate

Is product testing costing more than it should? That is one of the first questions test engineers at Burton Industries, Inc. ask when evaluating new projects. Printed circuit board assembly (PCBA) complexity, project volumes and defects per million opportunities (DPMO) estimates all factor into what tests should be required.  But here are five key areas to check in analyzing whether or not there may be opportunities for cost reduction:_FBP4942

  • Can a faster tester be used? Case in point, Burton Industries’ CCI automated functional test platform reduces typical functional test time from 5 minutes to under a minute, over older similar functional test platforms.
  • Can NRE be reduced through use of connector-based testing? The CCI functional tester can use either bed-of-nails fixtures or do connector-based testing, provided the PCBA design allows test access via the connector.
  • Has the product been evaluated for the best test and inspection strategy? Burton Industries’ team analyzes the right mix of inspection and test steps for each customer’s goals. The Company’s current inspection and test capability includes automated optical inspection (AOI), 2D x-ray inspection, a Checksum manufacturing defect analyzer (MDA) tester, in-circuit test, automated functional test and custom functional testing, providing a wide range of options in inspection and test step combinations.
  • Are test point accessibility issues driving higher cost? In-circuit testing can cut test costs in higher volume PCBA manufacturing when the PCBA is accessible enough to ensure good coverage, however, when that isn’t the case the solution is often greater levels of inspection or longer functional test cycles. Self-tests such as boundary scan testing can help improve test coverage in PCBAs with limited test point access. To achieve maximum benefits boundary scan cells need to be included on all pins.
  • Is there a final program, test, pack and ship station? Combining testing and programming can save some time over separate processes. Having that work cell also pack and ship the product enhances configuration management by minimizes the opportunity for mislabeling or mispackaging products that are configured to order.

The team at Burton Industries is focused producing products at the lowest possible costs and routinely evaluates these areas to better optimize test strategy.

Visit Burton Industries at AMCON Novi, Nov. 10-11

The Burton Industries team will be exhibiting in booth 111 at AMCON Novi (Detroit), MI in the Suburban Collection Showplace on Nov. 10-11. Click for Your Free Registration